Microfluidic Cooling Innovation Tackles Heat at the Chip Level
Developed by mechanical engineering Ph.D. Daniel Lorenzini, the liquid cooling solution uses microfluidic channels—tiny, embedded liquid pathways—to draw heat away from silicon chips
Modular Flexible Liquid Cooling System for Silicon Photonics Chips
This page brings together solutions from recent research—including microelectromechanical jet arrays for impingement cooling, microchannel surfaces with engineered turbulence structures, multilayer cooling architectures with optimized fluid routing, and additively. This page brings together solutions from recent research—including microelectromechanical jet arrays for impingement cooling, microchannel surfaces with engineered turbulence structures, multilayer cooling architectures with optimized fluid routing, and additively. Josh Gess's lab is using techniques like immersion cooling and microfluidics to develop novel solutions. Josh Gess is in a sweet spot for creating novel solutions for t...
Beyond TIM: Microchannel Architectures for Advanced
From conventional fans and air cooling, to advanced cold plates and liquid cooling loops, to next-generation microchannel-based liquid cooling,
AI chips are getting hotter. A microfluidics
Today, Microsoft announced that it has successfully developed an in-chip microfluidic cooling system that can effectively cool a server
Microfluidic Cooling Systems for Processor Thermal Management
A liquid cooling module for electronic devices, particularly foldable mobile phones and wearables, that integrates a pump and cooling module into a single, flexible unit.
Mechanically-flexible wafer-scale integrated-photonics fabrication
The field of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integrated-photonics platforms and fabrication processes being demonstrated at both infrared and visible
Co-designing electronics with microfluidics for more
Cooling efficiency is greatly increased by directly embedding liquid cooling into electronic chips, using microfluidics-based heat sinks that are
Immersion Cooling in Silicon Photonics | Dustphotonics
Immersion cooling involves submerging computer components in a thermally conductive, but electrically insulating liquid. This method stands out for its
A manufacturable platform for photonic quantum computing
These components are fabricated in a commercial semicon-ductor foundry14, using a fully integrated 300-mm silicon photonics process flow, with all operations on-chip.
Energy-efficient cooling of silicon-based microfluidic chips enabled by
Here, we design silicon-based microfluidics chips with integrated microstructural and surface modification strategies for energy-efficient cooling systems. A novel fabrication method that
Laser Precision: Cooling Chips With Photonics
Can lasers really cool computer chips by turning heat into light? Dive into the science behind photonic cooling and its potential to transform computing.
Microfluidic Cooling
Within the project CarrICool, IZM-ASSID worked on the realization of a double-sided liquid cooling technology by innovatively integrating horizontal and vertical
Liquid Metal-Based Chip Cooling Technologies: A Review
As an emerging cooling solution, the technology of using liquid metal as a cooling medium for chips has been the subject of many classic studies.
A review of the immersion liquid cooling technology for high
Coolant modification, liquid cooling structure optimization, and interface regulation are the three mainstream technical pathways for enhancing the performance of immersion liquid cooling
New solutions for semiconductor cooling | College of
Oregon State engineering researchers are partnering with industry leaders to explore innovative cooling technologies. Led by Josh Gess, the team
AI chips are getting hotter. A microfluidics breakthrough goes straight
Today, Microsoft announced that it has successfully developed an in-chip microfluidic cooling system that can effectively cool a server
Cooling computer chips by laser light for improved... | 2025/04/23
Cooling computer chips by laser light for improved performance and energy efficiency A US-based research consortium is working on developing a laser-based photonic cooling technology
Simulation and experimental investigation of liquid-cooling thermal
For the unique architecture of CPO, this study analyzes its heat dissipation needs in detail, and a thermal management scheme is designed. The thermal management scheme is
Direct-to-Chip Liquid Cooling Technology | JetCool
Build next-gen chipsets with on-silicon cooling, eliminating thermal bottlenecks. JetCool''s direct-to-chip liquid cooling modules use arrays of small fluid jets that
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Silicon Photonics Devices and Integrated Circuits
These developments have transformed silicon photonic circuits from simple passive structures to fully functional systems incorporating lasers,
Ultra-thermostable embedded liquid cooling in SiC 3D packaging
This ultra-thermostable embedded liquid cooling method for 3D packaging SiC power modules is promising for high power density EV inverters. Benefit from compatibility with the
Silicon Photonic Micro-Transceivers for Beyond 5G
Here, we report on the design and performance of a silicon photonic micro-transceiver required to operate in 5G and 6G environments at high
Shining a Laser Light on Heat: Cooling Chips with Photonics
The proof-of-concept system places a “photonic cold plate” above hot spots on a chip and uses laser-driven anti-Stokes fluorescence to extract heat. Early tests suggest this approach can
First steps towards interlocking modular microfluidic cooling
In future High Energy Physics detectors, the coverage of large surfaces with silicon pixel chip sensors poses a challenge for the sensors positioning, for their cooling, assembly, and
Project Descriptions_COOLERCHIPS
Nvidia will develop a novel modular datacenter with an innovative cooling system that combines direct-to-chip, pumped two-phase and single-phase immersion in a rack manifold with built-in pumps and a
Energy-efficient cooling of silicon-based microfluidic chips enabled by
In this work, we present silicon-based microfluidics chips with integrated microstructural and surface modification strategies to reveal the coupling mechanism and enable energy-efficient
Advanced Cooling System for Modular Electronics
This article will first discuss each of these components and provide general (design) guidelines. Subsequently, a study comparing an advanced
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